Ke Kumu Hana o ka Mea Hoomaemae Plasma

Plasma cleaners use plasma discharge to generate a high-energy oxidation reaction. Using oxygen or a mixed gas (such as oxygen + hydrogen) in the discharge zone, they form an ion plasma (energy range 5-15 eV). The high-energy electrons and radiation from these plasmas decompose surface contaminants (organic matter oxidation rate >90%), e hana ana i ke kinoea a i ʻole nā ​​mea hoʻoheheʻe. Hāʻawi kēia ʻenehana i ka hoʻomaʻemaʻe kemika -free, non{3}}contact, no laila kūpono ia no ka hoʻomaʻemaʻe ʻana i nā metala (e like me ke kila kila a me ka aluminika) a me nā polymers (e like me ka PTFE), a ua kūpono loa-no ka hoʻomaʻemaʻe ʻana i nā mea uila a me nā mea lapaʻau.

Ma ke ʻano o ka hoʻomaʻemaʻe hoʻomaʻemaʻe, nā manawa lapaʻau maʻamau mai 2-10 mau minuke i kēlā me kēia pūʻulu. Hiki iā ia ke hoʻoneʻe i nā mea haumia nanoscale (ka nui o nā ʻāpana<100 nm), reduce surface contact angles by over 40°, and significantly improve material adhesion. Important operating parameters: maintain power between 50-1000W, air pressure between 10-100 Pa, and avoid overheating the substrate (temperature <150°C).